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ST110G

特点

● 优越散热性能

● 优良的耐热性及可靠性

● 较低 Z-axis CTE

应用领域

● PCB散热解决方案

● 汽车电子

● DC/ DC逆变器等

  • 产品性能
  • 产品证书
  • 资料下载
Items Method Condition Unit Typical Value
Thermal Conductivity ASTM-D5470 A W/ (m•K) 1.0
Tg 2.4.25D DMA 175
Td
2.4.24.6 Wt 5% loss 400
Thermal Stress 2.4.13.1 288℃, solder float s 300
T288 2.4.24.1
TMA

min

60
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 27
After Tg ppm/℃ 176
50-260℃ % 1.8
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ/cm 1.4x109
Surface Resistivity
2.5.17.1
C-96/35/90 1.5x107
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz HTE) 2.4.8 288℃/10s N/mm 1.15
Flammability
UL94
C-48/23/50
Rating
V-0
Water Absorption IPC-TM-650 2.6.2.1
E-1/105+D-24/23 % 0.10

Remarks:

1. All the typical value is based onthe 0.5mm specimen(5x106). The Value of water absorption andCTE(Z-axis) is based on the 2.0mm(15x2116).

2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.

3. UL certificated Single/Double sidePCB min. thickness 0.38mm.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letterindicates the duration of preconditioning in hours, the second digit thepreconditioning temperature in ℃ and the third digit the relativehumidity.

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